Concept of a Mechanical Test Setup for Packaging Materials Using Digital Image Correlation Methods

This paper presents a concept for a mechanical testing apparatus for electronic packaging materials that benefits from the usage of digital image correlation (DIC) for strain measurement. In contrast to similar test setups, which use a CCD-microscope as an attachment to the mechanical test setup, the new concept tries to attach the mechanical test setup to a professional research microscope. The intention is to improve the projection of the object field to the CCD sensor array of the microscope-camera, and thus to improve the strain measurement of miniaturized samples. To be able to perform experiments at higher temperatures a suitable temperature-controlled test chamber was also designed. The paper shows the realization of the test setup and presents the first experiments with suitable specimen that will also be discussed.