Fluxless Soldering in Activated Hydrogen Atmosphere

A novel hydrogen activation technology based on activated hydrogen or electron attachment (EA) is developed for fluxless soldering at ambient pressure and normal soldering temperature. The technology has a potential to be used for a list of applications in the electronics packaging industry and recent work by a joint effort between Air Products and Sikama International on alpha trials of a production-scale furnace for flux-free wafer bump reflow based on electron attachment (EA).