Analysis of Parasitic Effects by Bonding Structure

In this paper, a direct-bonded copper (DBC) substrate with wire-bonding and a DBC substrate with clip-bonding are designed and fabricated to compare inductance as their structure. Through a comparison of them, it is proved that the clip for the semiconductor package is suitable for decreasing inductance and direct current resistance (DCR). Also, the clip which has reduced inductance and DCR is expected to improve switching characteristics and efficiency in the power conversion system.