A Novel Structure of Bondwire and Microstrip Lines for Chip-to-Chip Inter-Connection Up to 130GHz

A novel structure of bondwire and microstrip lines for Chip-to-Chip inter-connection up to 130GHz is firstly pre-sented in this paper. Its realization is based on PCB heterogeneous integration process. In order to reduce its high inserted loss which mainly caused of high inductance of the bondwire, the microstrip line of the structure is then optimized. Simulated results show that the minimum insertion loss of 1.0 dB for the structure can be achieved, with the bandwidth more than 35 GHz in bands of 100-135 GHz.