Investigations at the Interface of a Multilayer Structure Made of Non-Conductive and Conductive Resins

The paper presents the investigation of composite structures made by overlapping two or more layers of resins, including conductive resins, at different time intervals, as well as different temperatures. This situation occurs in the case of a model of implementing an innovative concept of manufacturing electronic modules without using solder alloy, the Occam process. According to this approach, the interconnection structure is arranged on several layers with conductive paths separated from each other by dielectric layers. It is interesting to characterize the interface between layers to determine the possible effect on the reliability of the module. Samples of at least two layers of three types of resins were investigated using Scanning Electron Microscopy/Energy Dispersive X-Ray Spectroscopy analyses. These analyses emphasized there is no chemical bonding at the interface between the layers of resins, but only mechanical. This is a major disadvantage that can lead to the dismantling of the assembly under the action of mechanical forces and environment conditions.