Evaluation of Microstructure and Electrical Property of Cu/graphene Composite Coatings for Electronics Interconnections

In the present work, Cu/graphene composite coatings with graphene nano-platelets (GnPs) as reinforcement were prepared by sediment pulse reversed electroplating (PRE) method. The surface and cross-section microstructures of the Cu/graphene coatings were evaluated by SEM, FIB, XRD and Raman Spectroscopy. The 4-point probe method was used to measure the electrical properties of the Cu/graphene coatings. The results showed that the incorporation of GnPs has little effect on the grain orientation of the deposited Cu but led to a slightly higher resistivity of 5.55×10
^-5
Ω·cm with 0.5 g/L GnPs in the plating solution.