Advanced DAF for high die stacking application

Die Attach Film (DAF) is widely used in semiconductor industry for decades. As direct material, DAF plays more and more important role in assembly quality, yield and reliability. Especially, it makes great difference in advanced packaging, especially high die stacking packaging. Therefore, DAF is improving and make evolutions all the time.In storage industry, 3D wafer technology keep evolution, die thickness keep thinner & the density of stacking die in one package keep increasing. The packaging challenge start to focus on chip warpage (Fig 1 and Fig 2). The impact of serious chip warpage will induce defects like die to die peeling, molding compound insertion and DAF void. Those impacts cause product yield loss and quality concern. All these challenges call for research and development of advanced DAF material. In this paper, the mechanism for die-to-die peeling, Mold compound insertion and DAF void is introduced, and advanced DAF material which developed for the challenge upon the mechanism, been introduced on the effectiveness.