Fabrication of Ni Nanocones on Glass Substrate and its Application in LED Packaging

Since high luminous efficiency is the key issue in LED packaging, glass substrate gradually comes to people's view. To meet the requirement of low energy cost and product reliability, a new low-temperature bonding method based on Ni nanocones electroplated on glass substrate is proposed. Fabrication of Ni nanocones on substrates is based on the basic electrochemical and crystallographic theory. The surface morphology and roughness were observed by atomic force microscope (AFM). Scanning electron microscope (SEM) was used to analyze the morphology of Ni nanocones, with that on different substrates compared. The results indicate that the morphology of cones is significantly affected by the roughness of substrates, while the size and density can be controlled by adjusting the electrodeposition parameters on glass substrate. Furthermore, the principle of the low-temperature bonding method is illustrated with the model which has potential to be used in LED packaging.