Ceramic Packages for High Speed Fiber-optic Communication Modules

This paper presents a high frequency performance and high reliability ceramic package for high speed fiber-optical communication modules up to 100 Gbps. The radio frequency (RF) feedthrough of the package includes four 100 Ohm differential pair lines. The RF performance of the feedthrough was validated with on-wafer scattering parameter measurements. The test sample consists of flexible printed circuit (FPC), ceramic feedthrough, adaptor and bonding wires, wherein the input terminal of the feedthrough was bonded to the adaptor through the wire, and the output terminal was soldered with FPC. The measured results of four 100 Ohm differential pair lines exhibit return loss values better than 15dB, up to 40GHz, thus the package can be applied to 100 Gbps transmission rate. Moreover, in order to ensure the high reliability, the stress distributions were simulated and analyzed by using the finite element method. The metal base material and structure of the package were analyzed. The mechanical and environmental tests were conducted to verify this package reliability. Hence, the package shows the good RF performance and high reliability.