Stress-strain analysis of micro-scale CSP solder joint under torsional vibration combined loading

This ANSYS was used to establish a coupled stress-strain analysis model of micro-scale CSP solder joints. The effects of solder joint material, solder joint diameter, pad diameter and solder joint height on torsional vibration coupling stress-strain of micro-scale CSP solder joint are analyzed. Under the torsional vibration combined loading condition, in the micro-scale CSP solder joint array, the maximum torsional vibration stress and strain appear on the solder joints at the outermost top corner of the array. The torsional vibration coupling stress is the largest when the solder joint material is SAC387. The torsional vibration coupling stress is the smallest when the solder joint material is 62Sn36Pb2Ag. As the diameter of the pad and the height of the solder joint increase, the maximum torsional vibration coupling stress-strain within the micro-scale CSP solder joint decrease. The maximum torsional vibration coupling stress-strain in the micro-scale CSP solder joint increases with the solder joint diameter increasing.