Properties of Ag-Cu alloy substrate for Y-Ba-Cu-O superconducting tape

Textured structure, surface morphology and tensile strength of Ag-Cu alloy tapes and Ag-Cu/Ni alloy clad tapes are studied by using XRD, pole figure, SEM and AFM. An addition of Cu was effective for improving surface smoothness; [210]<120> textured structure, on which YBCO film aligns in-plane, was obtained in Ag-Cu tape. Clad tapes which have 2-4 times higher proof stress 60.2 than pure Ag at 700/spl deg/C were obtained. These clad tapes are expected to be useful for obtaining low-cost and high-J/sub c/ YBCO superconducting tape.