Loading [MathJax]/extensions/MathZoom.js
Investigation and Mitigation of Radio Frequency Interference Caused by Weak Grounding of USB Type-C Receptacle Connector | IEEE Conference Publication | IEEE Xplore

Investigation and Mitigation of Radio Frequency Interference Caused by Weak Grounding of USB Type-C Receptacle Connector


Abstract:

In modern mobile electronic systems, USB connector has been identified as one of the dominant noise sources for desense issues. In this paper, the noise coupled to the Wi...Show More

Abstract:

In modern mobile electronic systems, USB connector has been identified as one of the dominant noise sources for desense issues. In this paper, the noise coupled to the Wi-Fi antenna from a USB connector is investigated. With the assistance of full-wave simulations, the root cause of desense noise is identified as the non-ideal electrical connection between the metal chassis and the USB receptacle shell where it is installed. The proposed radiation mechanism is validated through measurements of a real tablet device, and 15 dB noise level reduction is observed with a better grounding structure.
Date of Conference: 28 July 2020 - 28 August 2020
Date Added to IEEE Xplore: 10 September 2020
ISBN Information:
Conference Location: Reno, NV, USA
Citations are not available for this document.

I. Introduction

With the increasing complexity and miniaturization of modern mobile platforms, including mobile phones, tablets, and laptops, the distances between antennas and high-speed integrated circuits (ICs) or connectors are driven closer, which intensify the radio frequency interference (RFI) issue. In addition, the ever-growing demands for higher data transfer rate make the matter worse. As discussed in [1], the noise could be generated by different noise sources, such as liquid-crystal displays [2], digital microphones [3] and switching power supplies [4].

Cites in Papers - |

Cites in Papers - IEEE (3)

Select All
1.
Taiki Kitazawa, Kimihiro Arai, Youngwoo Kim, Daisuke Fujimoto, Yuichi Hayashi, "A Novel Remote Visualization of Screen Images Against High-Resolution Display With Divided Screens Focusing on the Difference of Transfer Function of Multiple Emanations", IEEE Transactions on Electromagnetic Compatibility, vol.64, no.6, pp.1941-1948, 2022.
2.
Qiaolei Huang, Jaswanth Vutukury, Deepak Pai, Gary Rara, Akshay Mohan, Jagan Rajagopalan, "Simulation Based EMI Prediction for High Speed Differential Signals", 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.728-732, 2021.
3.
Xin Yan, Chunyu Wu, Dave Zhang, Shuai Jin, Songping Wu, Jun Fan, Chulsoon Hwang, "EMI Investigation and Mitigation of Flexible Flat Cables and Connectors", 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.515-519, 2021.

Cites in Papers - Other Publishers (1)

1.
Raveena Jokim Crastha, Roopa M, "Design of SMPS Buck Converter with Protection Circuits for Automotive Charger", International Journal of Innovative Technology and Exploring Engineering, vol.10, no.8, pp.120, 2021.
Contact IEEE to Subscribe

References

References is not available for this document.