High Temperature Deformation Field Measurement Using 3D Digital Image Correlation Method

A full-field, three-dimensional and non-contact deformation field measurement method under high temperature environment based on 3D digital image correlation (3D-DIC) is introduced. In order to reduce the impact of high temperature radiation on the image quality, a band-pass filter is placed in front of the camera lens. The two cameras simultaneously take pictures of the object before and after deformation, and use 3D-DIC to measure the three-dimensional deformation field of the object surface. The high temperature deformation field measurement test shows that 3D-DIC can accurately and conveniently measure the deformation field of an object under high temperature environment.