EMI Shielding Technology in 5G RF System in Package Module

The 5G revolution have brought about the huge impact for the communication industry which produces a series of innovative technologies, such as Sub 6Ghz and millimmeter wave (mmWave) 28Ghz spectrum, beam forming, multiconnectivity and edge computing are widely applied in the 5G generation for high speed data transmission and low latency purpose. Furthermore, system in package (SiP) module design and assembly technology plays an key role in IOT, antenna in package (AiP) and RF module applicatons, compare to the tranditional SiP design, the Electromagnetic Interference (EMI) shielding technology is the important factor to influence the shielding effectiveness (SE). In this paper, the EMI coating and partition technology in SiP module will be discussed and analyzed in comformal and compartment shielding methold individually.In this study, Test Veihcle is designed with RF module with EMI shielding and partition technology. In the first part, the various sputter coating material and thickness are demonstrated by Near-Field Scanner meathold, compare to the conventional Cu coating layer, the Cu/Ferrite coating layer have improved about 10 dB SE at 6Ghz high frequency and 30 dB SE at 3MHz low frequency range sucessfully. In addition, the comparison between metal frame and epoxy paste partition shieldig capability resutls are discussed as well in this paper. Thus, the fillng material of metal frame, paste epoxy and SUS+Cu are demonstrated 40 dB SE improvement at 28GHz mmWave frequency by vector network analyzer (VNA) measurement. All of above physical phenomenon will be discussed in detail in the following sections.Finally, the reliability verification of EMI shielding on advanced SiP module will utilize standard JEDEC test condition including Temperature Cycle Test (TCT), High Temperature Storage (HTS), unbias-high accelerated stress test (u-HAST) results to verify the package structure. By employing this SiP structure with EMI shielding technology, the Shielding effectiveness (SE) are improved obviusly in both comformal and compartment structure. Undoubtedly, SiP with EMI shielding structure is absolutely the most innovative technology in the 5G generation.