Mechanical Design of a 3D CMOS Compatible Microelectrode Array for Neural Interfacing

Microelectrode arrays (MEA) are a key technology for the study of neuronal circuits, facilitating electrical stimulation and recording of extracellular action potentials. The utility of silicon-based neural interfaces is limited due to the inherent 2D nature of CMOS technologies and the relatively high stiffness of these inorganic materials. In this work, silicon-based structures for in vitro neural interfacing are investigated which aim to combine mechanical compliance with high spatial resolution. Performed simulations concern mechanical deformations and are carried out using COMSOL Multiphysics® software. These mechanical designs may serve as an inspiration for further development of compliant 3D silicon-based CMOS compatible structures for neural interfacing at high spatial resolution.