Static and dynamic behavior of memory cell array opens and shorts in embedded DRAMs

Fault analysis of memory devices using defect injection and simulation is becoming increasingly important as the complexity of memory faulty behavior increases. In this paper this approach is used to study the effects of opens and shorts on the faulty behavior of embedded DRAM (eDRAM) devices produced by Infineon Technologies. The analysis shows the existence of previously defined memory fault models, and establishes new ones. The paper also investigates the concept of dynamic faulty behavior and establishes its importance for memory devices. Conditions to test the newly established fault models are also given.