An agile and scalable manufacturing model to support 5G growth

The increasing number of RF, microwave and analog-intensive-mixed-signal IC applications had led, over the two last decades, to the emergence of engineered substrate technologies that have helped to increase the adoption of the specialty foundry model for the semiconductor supply chain. In this paper we will review engineered substrate technologies with a special focus on 5G and its use case scenarios. We will also discuss how using 100% standard toolset and agile rampup techniques, engineered substrates could be manufactured to meet the stringent time-to-market and yield requirements of a semiconductor market in constant evolution