Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly

We have worked on multichip-to-wafer (MC2W) 3D and heterogeneous integration and packaging using capillary self-assembly (CSA) with liquid droplets. In this work, microbump bonding and direct bonding technologies in face-up and/or facedown fashion are discussed for 3D-IC fabrication including 3D interconnect formation. Here “non-transfer 3D stacking” like flip-chip bonding and “transfer stacking” called reconfigure-wafer-to-wafer using self-assembly and electrostatic (SAE) carrier are explained. In addition, CSA application in flexible hybrid electronics (FHE) and micro-LED display is introduced.