Finite element analysis of the fabrication process of CCGA package

In this paper, a three-dimensional model of Ceramic Column Grid Array (CCGA) package is established by finite element method, and the reliability of copper pillar bumps under the five manufacturing processes of copper pillar plating, solder joint welding, underfill filling, thermal paste filling and cover sealing is analyzed. Finally, this paper provides guidance for the optimization of fabrication process based on the results of finite element simulation. The results show that the stress and strain values of the solder joints are relatively large due to the higher reflow temperature; relatively large warpage values are generated when the filler and the thermal paste are filled; at the end of the fabrication process, the stress accumulation (von Mises stress) of the copper pillar bumps at the four corners of the package is maximized, and most likely to fail.