Thermal design and analysis of power LED packaging based on graphene

With the development of LED chip and packaging to the high power direction, improving the internal structure of the tube core and packaging, to solve the problem of heat dissipation, has become the mainstream direction of LED research. In this paper, a basic structure with sapphire epitaxial growth GaN flip-chip, film direct bonded copper substrate and array package was employed. Two-dimensional material graphene-based film with high thermal conductivity was applied into encapsulation structure of power LED to conduct transverse thermal diffusion of local hot spots, which would change the heat conduction path and improve the heat dissipation efficiency. Combined with the thermal resistance network of the power LED packaging structure and the simulation results of application in different ways of graphene-based film, the influence mechanism of graphene on the heat conduction of power devices was analyzed. It showed that the heat dissipation application of graphene in power LED packaging should be as close as possible to the GaN chip hot spots.