Design and Simulation of a Micromechanical Silicon Resonant Accelerometer with Low Temperature Sensitivity

Because of the mismatch of material properties between silicon and glass, especially the mismatching thermal expansion coefficients, the Micromechanical Silicon Resonant Accelerometer based on the Deep Dry Silicon On Glass (DDSOG) technique is seriously affected by the temperature during the fabrication, packaging and use processes. Based on the working principle and temperature characteristics of Micromechanical Silicon Resonant Accelerometer, the effect of the mismatching thermal expansion coefficients of silicon and glass is analyzed, and a Single-Anchor-Supported accelerometer structure with low temperature sensitivity is designed. Simulation results show that the structure can effectively reduce the effect of mismatching thermal expansion coefficients of silicon and glass.