Thermal Analysis and Material Selection of the SiC Based Intelligent Power Package

In this study, an intelligent power package with body size of 40mm×40mm is proposed. The thermal performance of the package with different material options has been analyzed and the materials which produce best thermal performance have been recommended for the final assembly of the package. The proposed power package consists of two high power rated SiC chips, two temperature sensor chips, one customized lead frame (LF), four pieces of customized metal clips and a flexible printed circuit (FPC). The material options include difference die attach materials, solder joint material (JM), molding compound material (MC) and thermal interface materials (TIM). A 3D thermal model is built to analyze the thermal performance of the proposed power package and different material combinations have been applied to the thermal model. The temperature field in the proposed power package has been simulated and the temperature profile of the package has been obtained. The thermal resistance of the proposed power package with different material options has been extracted. The analysis results show that the TIMs impose the most significant effects on the thermal performance of the power package, while effects of die attach materials, solder joint materials and molding compound material on the thermal performance of the package are negligible.