EMI Shielding Solutions for RF SiP Assembly

From 3G, 4G to 5G, the world is going much faster than before, and our information input also gets easier day after day. The radio frenqency is the major key for our live improvment. In this moment everyone would like to understand more about radio frequency (RF) for the 5th generation (5G) telcommunciation. How it works and what impact become more important for the radio frenquency (RF).The 5th generation (5G) telcommunciation have different working specdrum for Sub 6GHz and hige frenquency millimeter wave (mmWave). Recently, millimeter wave (mmWave) of radio frequency range be focus on 28GHz and 39GHz, both of frequencys can offer excellent network coverage in the city. The antenna design for 5G wireless telcommcation is getting important, and the mmWave antenna is designed by array antenna to beamforming the Radio frequency signal to the networking devices to achieve high speed data transmission requirement.The system in package (SiP) module can do the high density heterogenous integration with small factor size such as antenna in package (AiP) and high electrical performance. The electromagnetic interference (EMI) is very important since it can impact to electronic devices and equipments. To meet the high frequency of EMI requirements, the EMI shielding has provide the signal isolation between different function blocks such as digital, analog and RF antenna devices in SiP module. In this paper, a test vehicle is designed to evaluate the shielding effectiveness (SE) by vector network analyzer (VNA) and the different EMI shielding comparsion and the sputter coating will proceed and measure the actual study.There are many ways can do the electromagnetic interference (EMI) shielding on System in Package (SiP) module, but which one method will be best and suitable for the design especially it will be used for 5G mmwave or RF design wearable connectivity device. Since wearable and smart phone devices have space limitation, the packaging size been request small form factor and high density integration than before. Based on the request, how to select the suitable EMI shielding method become more important and we will do the comparsion for the paper discussion. Finally, this paper will find out the advanced SiP with EMI shielding solutions for future 5G connectivity RF devices application.