Metalization impact on heat transfer through sintered nanosilver based thermal joints

Research aim was to develop thermal analysis method of thermal joints made by sintered silver nanoparticles in real structures. Each layer in sandwich-like structures in typical microelectronics structures introduces thermal resistance of layer and simultaneously thermal resistance of contacts between neigbouring layers. Each thermal resistance affects heat transfer. The idea was to find if reducing number of layers improves heat transfer efficiency. Thermal analysis were performed with using infrared camera (thermographic method), where main advantage is that measurements are contactless. Typical thermal analysis methods for strongly conductive layers (like sintered silver) are insufficient, because temperature difference might be at level 0.1 K and using variable signals may solve such problem.