I. Introduction
There is a vast need for fast high voltage switches to be used in power electronics and pulsed power applications. Wide bandgap (WBG) semiconductor materials have multiple advantages over typical semiconductors that have helped significantly advance high voltage switching over the last decade [1]. Table 1 shows the superior material properties of SiC and GaN to Si or GaAs for high voltage switching, namely their wide bandgap and breakdown field. GaN, specifically, has the largest bandgap, which results in less thermally generated carriers, a high breakdown field, which results in smaller device widths for similar breakdown voltages in Si or GaAs devices, and a mid-range thermal conductivity, which allows for elevated temperature operation of GaN PCSS. These parameters lead towards smaller systems with smaller devices and lesser thermal management requirements.