CMOS Compatible III-V/Silicon Laser Integration on Silicon Photonics Platform

In this paper we present the hybrid III-V/Si photonic platform developed in CEA-LETI. The overall integration is done in a fully CMOS compatible 200mm technology, scalable to 300 mm wafers, leveraging the large scale integration capabilities of silicon photonics. III-V material is integrated on top of a mature silicon photonic front-end wafer through direct molecular bonding enabling the monolithic integration of light sources. Fabry-Perot laser reference design is used as test vehicles for the process validation. Finally, thermal simulations have been done to evaluate device optimization to improve its thermal behavior.