Sub-Micron RDL Patterning for Advanced Packaging

More than Moore strategies have been a hot topic for more than a decade, and Redistributed line (RDL) layers in next generation interposers will require sub-micron patterning. A key lithography challenge for fine-RDL in interposer applications is providing a sufficient Depth of Focus (DoF) to accurately resolve sub-micron features. To meet this demand, Canon's FPA-5520iV steppers can now provide new projection optics offering Numerical Aperture (NA) 0.24 imaging and 52 × 34 mm exposure field. FPA-5520iV steppers with NA 0.24 provide excellent 0.8 μm resolution performance throughout all imaging fields.