Advanced Multifunctional Temporary Bonding Materials with Heterogeneous Integrated Properties for Various Advanced Packaging Applications

There is always an increasing demand for new materials with unique properties as technical enablers to facilitate different semiconducting advanced packaging platforms. This long-lasting demand is more urgent than ever due to the era of a slowing Moore's Law, which indicates advanced packaging will play a key role in achieving smaller factor, higher I/O density, better electrical performance, and lower cost of ownership in final devices in the future semiconductor development. A tremendous amount of effort has been carried out on development of various platforms in advanced packaging, such as flip chip, fan-in wafer-level packaging, fan-out wafer-level packaging, embedded die, and through-silicon vias. Therefore, with the addition of newly emerging advanced packaging platforms comes increased needs for new materials that can implement these technologies.In this work, a class of advanced multifunctional temporary bonding materials with heterogeneous integrated properties is presented. The concept is based on the combination of various unique properties such as low softening temperature, curability by either heat or UV light, and laser sensitivity in a single-component material. As a result, the newly developed materials can be bonded or laminated at relatively low temperature followed by hardening under heat or UV light for desired mechanical/thermal stability to ensure the success in downstream processes. In the end, a laser debond can be conducted to facilitate wafer/substrate detachment. The materials have been extensively characterized with various characterization methods. In addition, the preliminary data will be presented to demonstrate their potential as technical enablers in diversified advanced packaging platforms, such as in integrated fan-out (InFO) and redistribution layer (RDL)-first fan-out (FO).