Die Attachment Material based on Micro AG Paste for the Application of High Powder Devices

Sintered Ag paste having the high temperature stability and high thermal/electrical conductivity are considered to be the most promising candidate as die-attaching materials for high power devices. In this work, a new micro Ag paste including three kinds of Ag particles with different diameter and morphology was developed. It was easily sintered at low temperature of 200 °C to achieve a low resistivity of 4.1 μΩ·cm. High mechanical strength over 20 MPa was realized at only 180 °C for 30 minutes without any pressure, the strength was improved to over 40 MPa at 250 °C. The high performance corresponds to the dense microstructure due to the size-matching of Ag particles.