Design for Package Miniaturization for a MEMS Pressure Sensor

Sensor technology has become relevant to all aspects of life. Sensors have become central to everyday applications related to safety, security, health and consumer leisure. Sensors are also significantly present in industrial applications such as process control and monitoring. Consumer applications such as smart phones and wearables are nowadays increasing the integrity of various different sensors, significantly augmenting the final product functionality. In order to increase this functionality, maintain application at reasonable size and to increase the room left to the device battery, a drive for device miniaturization is introduced. This need becomes a challenging task at all levels of product cycle from design and virtual characterization up to assembly and testing characterization. This paper will present a methodology developed and employed at finite element modeling (FEM) stage in order to support virtual characterization for device miniaturization at design stage for a MEMS sensor package. All the aspects considered for virtual characterization shall be presented. The target of this methodology is to provide a useful guideline for package designers at an early stage of product development.