Study on the Cumulative Rule of Vibration Damage of BGA Solder Joint under Multi-Phase Condition

This paper from the fatigue life model, the damage accumulation theory and finite element simulation to study the three aspects, In view of the present under the condition of multi-phase, electronic products solder joint vibration fatigue damage accumulation problem of the unreasonable linear hypothesis, this paper puts forward the existing theory to seek a suitable for nonlinear damage cumulative rules under the rules of the vibration profile. The thesis mainly includes the following research work: Firstly, Using the Fourier transform, a two-phase vibration profile is established through two different phase vibration spectra. Secondly, the finite element simulation of BGA solder joint random vibration fatigue was carried out, and the simulation life of solder joints under each phase vibration was obtained. Finally, through the finite element simulation software for vibration fatigue damage cumulative model fitting shows that nonlinear damage cumulative Duyi Ye ductile in the theory of dissipation model is the most practical vibration fatigue damage cumulative rule.