Features of Silicon Wafers Eutectic Bonding Technology for MEMS

Technological process of manufacturing MEMS contains standard microelectronic operations and original technological processes. In this paper silicon wafers bonding process of eutectic soldering with thin gold layer deposited on the one of bonding wafer has been discussed. When testing samples after the process, the problem of uneven gold distribution across the substrate was discovered. To avoid the gold spreading effect during the bonding process a damping air clamp has been developed.