Membrane-supported Ka band resonator employing organic micromachined packaging

A scheme for employing organic materials for micromachining of the packaging structure of membrane-supported millimeter wave circuits is described. The format of the packaging follows that devised by Brown, Blondy, and Rebeiz [1999]. The organic micromachining process employs bulk parts patterned photolithographically from Epon(R) SU-8 photoresist adhered to polyimide membranes. Conducting elements are formed by evaporation of gold, followed by electroplating for thickness build up.