Mutual Coupling Reduction between Two Circular Patches Using H -Shape DGS

Isolation enhancement between two closely spaced microstrip circular patches is presented in this paper. Two patches are placed on the top of RO3003 substrate with thickness of 1.52 mm and relative permittivity of 3. Defective Ground Structure (DGS)of H -shape slot was inserted on the ground plan underneath the two patches to achieve mutual coupling reduction of 18 dB with an isolation of 0.05 λ
₀
edge-to-edge at 4.8 GHz. The total gain of single antenna fed in the array is 5.5 dBi after the present of the DGS. The array is suitable for MIMO applications where high isolation is required.