Additive-Manufacturing-Enabled Air-Filled Substrate Integrated Waveguide Microwave Components

A 3D-printed air-filled substrate integrated waveguide topology is proposed to mitigate the problems limiting the performance of dielectric-filled substrate integrated waveguide based components while maintaining its most interesting features. The proposed topology is showcased through the design of a 3D-printed coaxial-to-AFSIW transition and a power divider/combiner. Measurement results validate the excellent performance in terms of impedance matching and bandwidth.