Terahertz Flip-Assembled-CPW-Waveguide Transition Structure for InP DHBT MMIC Package

We present a novel coplanar waveguide (CPW) - waveguide transition structure for the package of terahertz (THz) monolithic microwave integrated circuits (MMICs). For the first time, flip-assembled CPW manufactured with quartz substrate is used to replace gold wire bonding to improve the performance of MMIC package in THz module. This no-wire transition structure significantly improves the transition performance in THz and avoid the package deviation.