Electrical Modeling and Simulation of AC-DC Thermal Transfer Devices to Investigate the Errors Sources

Physical structure of Single-Junction Thermal Converter (SJTC), Multi-Junction Thermal Converter (MJTC) and Thermal Current Converter (TCC) can be represented using electrical simulation of the equivalent modeling of LRC circuit. This work aims to investigate these devices by using (L Tspice) Simulator, in quest of better understanding the error sources. The technique was applied on (lV-SJTVC), (2V-MJTVC) and (10mA-TCC) at frequencies from 20 Hz to 1 MHz. The practical work was performed in NIS, Egypt and SASO, KSA. Samples of the relevant comparison results are given. A complete set of the evaluation results for the devices is available in full paper.