Optimal Design of Reliability and Signal Integrity for Embedded Micro-scale BGA Solder Joint

A finite element analysis model of ball grid array(BGA) solder joints and a three-dimensional electromagnetic simulation model were established, respectively. Then calculated the thermal fatigue life and the return loss value of the solder joints; the radial dimension of the solder joint, the height and the pad diameter of the solder joint were selected as design variables, the thermal fatigue life and the return loss of the solder joint were selected as the target. The multi-objective optimization design of BGA solder joints was carried out by the combination of experiments and grey correlation analysis. The results showed: the maximum equivalent stress of solder joints after optimization was decreased by 8.2%. The the return loss decreased by 11.8%, meantime fatigue life increase 2.15 times.