Fan Out Package: Performance and Scalability Perspective

Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor (<;200um thick) and competitive electrical performance and sensitivity performance are demonstrated. Extending this to new applications, a compact optical module has been designed in FOWLP and it proves to minimizing the signal loss of high resolution display information at a high transmission rate for HDMI 1.4 application. With through-via feature, FOWLP also offers PoP with heterogeneous integration of numerous active and passive components (~100 ea) offering flexible module product design. PLP is also discussed as the mass production technology with key technical aspects.