Development of Semiconductor Manufacturing System Integrating Wafer Process and Packaging Process Using a Half-Inch Sized Package

We have developed a semiconductor manufacturing system integrating a wafer process and a packaging process by using a half-inch sized package. The developed packaging tools are compatible with the tool-standard of Minimal Fab that we have already developed for half-inch wafer process. We have also developed a model process of a BGA package using the integrated system. We confirmed that MOSFET devices packaged in the BGA package worked electrically.