Multiphysics Model of Microstrip Structure Under High Voltage Pulse Excitation

This paper develops an innovative Multiphysics modeling of a microstrip line excited by high voltage. The introduced model enables us to calculate the Multiphysics phenomenon which cannot be performed with most of the electrical circuit simulation tools. The system understudy is assumed as an
RLC
transmission line (TL) with resistive load excited by input pulse wave voltage. The modeling concept is aimed to the understanding of the microstrip behavior intrinsic mechanism. The Multiphysics approach is based on the electrothermomechanical analyses. The thermal linear dependence of the RLC TL equivalent model is considered. The electrical system transfer matrix is introduced. Then, the microstrip structure thermal model is described based on the Cauer
RC
-network. The Multiphysics phenomenon is analyzed with the intrinsic interaction between the electrical power and the heat dissipation. The Multiphysics model is generated with the electrical, temperature, and microstrip line structure geometrical parameters. The modeling approach feasibility is illustrated by the analysis of the microstrip line under square wave pulses excitation with tens kilovolts amplitude. Numerical applications highlight the combined electrical, thermal, and mechanical effects onto the microstrip structure output voltage. Difference with the single physics as a classical electrical effect is evidenced.