A novel dual channel receive front-end module with MEMS technology

This paper introduces an dual channel receive front-end module which is fabricated by MEMS package technology. The module is composed of radio frequency (RF) components, is extremely-small, low-cost and high reliability. The microwave monolithic integrated circuits of the receive front-end module are mounted onto a silicon substrate fabricated by the MEMS technology. Some passive components, such as the filters, the attenuators and the transmission lines, are embedded in the silicon substrate. The full module consists of two low noise amplifiers, two digital attenuators, two mixers, a power divider, some chip capacitances and two MEMS filters. The measured receive gain and the output power at 1-dB gain compression point are 5dB and 0dBm respectively. By comparing with the samples obtained by the common process, while the performance of them are basically the same, which verifies the feasibility of the technical approach.