Development of novel AlN filler for high thermal conductivity packaging material

Nove l large particle size and round shaped AlN filler were developed by carbo-thermal-reduction and nitridation (CRN) method. They were suitable as high thermal conductivity filler for resin composite. Thermal conductivity of epoxy resin filled with the AlN filler could reach to 12W/m K. And also, fluidity of epoxy resin filled with developed novel AlN filler was improved with optimal blending ratio of the filler. The properties and evaluation of developed novel AlN filler for high thermal conductivity packaging material are discussed.