I. Introduction
One of the main challenge in power electronics is to design converters with high power density [1]. The development of wide band-gap components allows reducing the volume of power converter. This is mainly due to lower losses and the high switching frequency capabilities of Silicon Carbide (SiC) and Gallium Nitride (GaN) [2]. This, in turn, allows to reduce the thermal management (because of the lower losses), and to use smaller magnetics (because of the higher switching frequency). Passive components, e.g. inductors and capacitors, represent one of the largest share of the overall converter volume, so their reduction is especially important.