SDL analysis in temperature sensitive failure based on DALS system

In this study, we establish the SDL (soft defect location) system based on the DALS module of new Hamamatsu Phemos1000 system to analyze the temperature sensitive failure. Our results show that the DALS module is a significant platform to establish the SDL system on because it can mark the defect spot synchronously with the laser scan, and with some external equipment added in, it can isolate the temperature-sensitive defect with high accuracy. One case is showed to reveal the application in logic circuit block, which is failed to be analyzed by other non-destructive detection technique, such as PEM analysis, and too sensitive to perform microprobe analysis. Compared with the former SDL system based on IR-OBIRCH's amplifier, it shows higher accuracy to locate the defect which matched the PFA result and save a lot of FA resource.