Power integrity design for package-board system based on BGA

To reduce the coupling noise from the substrate, the power integrity (PI) analysis for the power distribution network (PDN) is becoming more and more important in today's package-board system design. Based on the ANSYS software, resonance and impedance of PDN were simulated firstly. And then the simultaneous switching noise (SSN) of the simulated circuit was done. By using target impedance design method, the parameters and the position of the decoupling capacitors were carefully designed. After comparing the initial simulation results of PDN impedance and resonance with those of optimized ones, the power ripple noise is obviously reduced.