Dielectric aging - overview & comment

Equations used to describe aging phenomena in extruded dielectric materials are reviewed and some new ideas are presented. Attempts are made to predict cable performance, and to see if cable materials have characteristic failure temperatures when subjected to thermal and electrical stress. The results are unsatisfactory, and highlight the simplistic treatment inherent in the starting equations. Also, the current method used to assess thermal degradation seems questionable. It is apparent that our understanding of aging is superficial and that blind acceptance of the equations used in this field is hazardous.