Reliability study on through mold via (TMV) for 3D microelectronic packaging under thermal and moisture loadings

Through mold via (TMV) provides a potential solution for the 3D microelectronic packaging. The reliability of the TMV is one of the major concerns during its applications. In this paper, the reliability of the TMV structure used for the embedded wafer level packaging (eWLP) was studied by the finite element simulation under the moisture 85°C/85RH, reflow and thermal cycling loading conditions. Fracture mechanics was used to calculate the strain energy release rate of the delamination between the plating copper and molding compound. The effects of the material properties and structure parameters were examined by the simulation results. The efforts can provide some guidelines for the reliability design of the 3D microelectronic packaging with TMVs.