Thermal analysis for hybrid pair module of Si-IEGT and SiC-PiN diode

This paper presents a thermal analysis and designs a water-cooled heat sink for an Si-IEGT and SiC-PiN diode module rated at 4.5-kV and 100 A. The operation temperature and thermal conductivity of the SiC-PiN diode are higher than that of the Si-IEGT. Therefore a design procedure for the water-cooled heat sink should be considered characteristics of each device. This paper shows a thermal analysis result using a 3D-FEM for the hybrid pair modules and demonstrates the experimental results using the prototype water-cooled heat sink for the 100-A module.