A fully packaged piezoelectric switch with lowvoltage actuation and electrostatic hold

This paper reports RF characterization of a fully packaged RF MEMS piezoelectric switch. The switch demonstrates better than 0.8 dB insertion loss at 2 GHz and 30 dB isolation up to 10 GHz. The presented device combines a piezoelectric actuation and a low electrostatic hold voltage to improve contact force. Actuation voltages of the switch are 5V for both piezoelectric actuation and electrostatic hold. This actuation was sufficient to obtain contact resistance lower than 2 ohms. The switch is packaged by wafer-level packaging technology using gap control, AuSn eutectic bonding and post-process Thru-Silicon Vias.